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公司名稱:昆山佰易儀器設備有限公司

Company name : KunShan BaiYi Instrument Equipment Co.,Ltd

公司地址:江蘇省昆山市牧野路99號3號房

Add:3# Building No.99,Muye Road ,Yushan Town ,Kunshan City ,Jiangsu,China

聯系電話Tel:0512-57991570

電子信箱Email:[email protected]
[email protected]

聯 系 人 Contacts:高先生

手機號碼 Cell phone:18606297225 

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  • 自動貼標機 Automatic Labelling Machine


    技術參數 Specification

    適用標簽長度 Applicable label length (mm) 6mm~250mm
    適用產品尺寸(長×寬×高/厚)
    Applicable product size
    (length x width x height/thickness)
    length: 40mm ~ 280mm
    width: 40mm ~ 200mm
    height: 0.2mm ~ 20mm
    適用標卷外徑(mm):
    Applicable standard volume outer diameter
    φ 280mm
    適用標卷內徑(mm):
    Applicable standard volume inner diameter
    φ76mm
    貼標精度(mm):Label accuracy (mm) ±1mm
    出標速度Label out speed(m/min): 步進Step 5~25m/min
    伺服Servo: 5~40m/min
    貼標速度Labelling speed(pcs/min) 步進Step 40~150pcs/min
    伺服Servo: 50~200pcs/min
    輸送速度Conveying speed(m/min) 5~16m/min
    重量Weight(kg): 約Around 180kg
    頻率Frequency(HZ): 50HZ
    電壓Voltage(V): 220V
    功率Power(W): 950W
    設備外形尺寸(mm)(長×寬×高)
    Euipment dimensions (mm)
    (length x width x height)
    2200mm×700mm×1400mm


    應用Application
    1.適用流體點膠,例如: UV膠、AB膠、EPOXY(黑膠)、白膠、EMI導電膠、SILICON、環氧樹脂、瞬間膠、銀膠、

    紅膠、錫膏、散熱膏、防焊膏、透明漆、螺絲固定劑等
    It is applied to fluid dispensing, such as, UV glue, AB glue,COB(black glue), white glue, EMI conductive glue, silicon,

    epoxy resin, instant glue, silver glue,red glue, paste, thermal grease, welding control paste, transparent paint, screw

    fixative and so on.
    2.應用于PCB電子配件固定及保護,手機、筆記本外殼粘接,LCD玻璃,LED點膠,雙攝像頭點膠與封裝,指紋模組點膠,

    車配件涂覆,芯片綁定,電池封裝,喇叭點膠,SMT底部填充、元件封裝、點錫膏、點紅膠、點黑膠、半導體封裝、

    晶元固定等;
    Applied to PCB electronic accessories fixed and protection, and mobile phone, notebook shell adhesive,LCD glass,

    LED point glue, dual cameras dispensing with encapsulation, fingerprint module point glue, auto parts coated,

    chip binding, battery encapsulation, horn point glue, SMT at the bottom of the filling,packaging, dispensing,

    points the red plastic, vinyl,semiconductor packaging, wafer fixed and etc .


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